[Les Cargill[_4_]]

http://ifixit.org/blog/6882/why-i-dr...t-in-the-oven/

--
Les Cargill

[jason]

On Tue, 30 Dec 2014 12:52:09 -0600 "Les Cargill"
wrote in article

http://ifixit.org/blog/6882/why-i-dr...t-in-the-oven/

I've baked electronics gadgets that got wet, but NEVER at 340. A few
hours at 125 seems to be sufficient. I'd have thought the LCD would be
fried at 340. Or baked, anyway.

[John Williamson]

On 31/12/2014 00:46, Jason wrote:
On Tue, 30 Dec 2014 12:52:09 -0600 "Les Cargill"
wrote in article

http://ifixit.org/blog/6882/why-i-dr...t-in-the-oven/

I've baked electronics gadgets that got wet, but NEVER at 340. A few
hours at 125 seems to be sufficient. I'd have thought the LCD would be
fried at 340. Or baked, anyway.

If you read the article fully, all that was baked at 340 for a strictly
limited time was the mother board in an attempt to reflow the solder on
the ball grid array mounted components. The problem wasn't damp
penetration, which could indeed have been driven off at a much lower
temperature.

--
Tciao for Now!

John.

[Mike Rivers[_2_]]

On 12/31/2014 1:46 AM, Jason wrote:
I've baked electronics gadgets that got wet, but NEVER at 340. A few
hours at 125 seems to be sufficient. I'd have thought the LCD would be
fried at 340. Or baked, anyway.

I'm going to call bull**** on this one. He's not trying to dry it out,
he's trying to reflow solder on the circuit board, which means melting
it. 340 degrees C (not F) is on the high side of the eutectic range of
standard solder, and lead-free solder needs to get 20 to 40 degrees C
hotter. A kitchen oven set to 340 degrees (F) would just get things too
hot.

He may have tortured it into working for a while, but at that
temperature, he didn't reflow the solder on the circuit board.

--
For a good time, visit http://mikeriversaudio.wordpress.com

[geoff]

On 1/01/2015 12:45 a.m., Mike Rivers wrote:
On 12/31/2014 1:46 AM, Jason wrote:
I've baked electronics gadgets that got wet, but NEVER at 340. A few
hours at 125 seems to be sufficient. I'd have thought the LCD would be
fried at 340. Or baked, anyway.

I'm going to call bull**** on this one. He's not trying to dry it out,
he's trying to reflow solder on the circuit board, which means melting
it. 340 degrees C (not F) is on the high side of the eutectic range of
standard solder, and lead-free solder needs to get 20 to 40 degrees C
hotter. A kitchen oven set to 340 degrees (F) would just get things too
hot.

He may have tortured it into working for a while, but at that
temperature, he didn't reflow the solder on the circuit board.



Sounds a bit of a syndrome. My iDaughter has a iSomethingAir that
crapped out with damp at great expense, Class Action ? No ! iDdicts
just cough up the $$$ every time. Makes them feel good.

geoff

[jason]

On Wed, 31 Dec 2014 09:39:12 +0000 "John Williamson"
wrote in article cghui3Ffnj2U1
@mid.individual.net


If you read the article fully, all that was baked at 340 for a strictly
limited time was the mother board in an attempt to reflow the solder on
the ball grid array mounted components. The problem wasn't damp
penetration, which could indeed have been driven off at a much lower
temperature.

I understand. I've made some small circuit boards with surface mount
components using a modified toaster oven (per an article in QST a while
back). I doubt if his procedure actually reflowed any solder and am still
surprised it didn't damage anything else.

[John Williamson]

On 31/12/2014 14:07, Jason wrote:
On Wed, 31 Dec 2014 09:39:12 +0000 "John Williamson"
wrote in article cghui3Ffnj2U1
@mid.individual.net


If you read the article fully, all that was baked at 340 for a strictly
limited time was the mother board in an attempt to reflow the solder on
the ball grid array mounted components. The problem wasn't damp
penetration, which could indeed have been driven off at a much lower
temperature.

I understand. I've made some small circuit boards with surface mount
components using a modified toaster oven (per an article in QST a while
back). I doubt if his procedure actually reflowed any solder and am still
surprised it didn't damage anything else.

Yes, re-reading it, he's talking in Fahrenheit for the baking and
Celsius for everything else. 340 F won't even soften the solder. Small
thermal movements of the components could well give exactly the effects
he describes.

--
Tciao for Now!

John.