[isw]

In article ,
Eeyore wrote:

geoff wrote:

Eeyore wrote:
Gareth Magennis wrote:

Am I right in my belief that putting heatsink compound on silicon
pads gives less thermal conductivity than pads alone?

Do you mean silicone pads ?

There's simply no purpose in using heatsink compound with them. In as
much as it adds something to the thermal path it must increase the
thermal resistance at least by a tiny bit.

Bring back mica and berlyium oxide.

I prefer live heatsinks myself. That helps keep the device die that much
cooler.

And adds greatly to the capacitance of whichever electrode is connected
to the case. Usually a bad thing, design-wise.

Isaac