Thermal pads for transistor mounts
Gareth Magennis wrote:
My understanding was that silicon pads already have the optimum contact with
both surfaces due to their squidginess. Putting 2 layers of thermal
compound with less than 100% thermal conductivity between them is only going
to make things worse.
I just seem to remember reading something about this somewhere, but that
does not of course make it true.
Your understanding is perfectly correct.
Graham
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