[Eeyore]

Serge Auckland wrote:

"Gareth Magennis" wrote

Am I right in my belief that putting heatsink compound on silicon pads
gives less thermal conductivity than pads alone?

My understanding is that thermal compound couples the bottom of the device
to the heatsink by filling-in the tiny interstices that would otherwise
exist between the slightly rough device and the slightly rough heatsink.
Consequently, heat is conducted better than it would be if the device were
clamped directly to the heatsink.

Irrelevant to silicone pads as they confrom to the mating surfaces themselves.

Graham